The core competence "Interconnect Technologies" is based on the experience of the research and development carried out since 1991 at the Center for Microtechnologies ZfM of Chemnitz University of Technology, founded as the "Technikum Mikroelektronik" already in 1979. With the foundation of Fraunhofer ENAS and the establishmant of the department Bach-end of Line, competences were trensferred to Fraunhofer ENAS.

The core competence is characterized by two main elements:

• Material and process development as well as process integration for interconnect systems ans NEMS
• Modeling and simulation of processes and equipment, of material properties and behavior of materials as well as interconnect systems

With respect to the experimantal work, the following topics are in the focus:

• Low-k / ultra Low-k materials - deposition, patterning, integration as well as charakterization and k-terning, alternatively airgap conceps and techlology
• CVD and ALD especially for metals - process development based on metalorganic precursors, evaluation of new precursors, Cu-CVD integrations schemas for metallization systems and through silicon vias (TSV)
• In-Situ-plasma diagnostics - development and optimization of plasma-based etching

Based on the available equipment, complete damascene architectures with Cu/low-k as well as airgap-based metallization schemas can be realized on wafers up to 200 mm diameter. Additionally, new research domains are addressed:

• Development of stressors for modility enhancement of charge carries in MOS transistors,
• Wafer-level intrgration of carbon nano tubes (CNT) into interconnect systems and NEMS,
• Integration of sensor materials, e.g. spintronic film systems for GMR sensors.

The modeling and simulation activities concentrate on processes like PVD, CVD or CMP. Another focus is put on models and simulation of devices and nano structures as well as on material properties at the nanometer scale. In this manner, modeling and simulation supports the technology development. The close interaction of the two main elements, modeling and simulation with material and process development and integration, represents a unique feature.