Design and Test of Components and Systems
Fraunhofer Institute for Electronic Nano Systems
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- OLYMPUS DIGITAL CAMERA
Electronic micro and nano systems use shaped elements and functional components which have dimensions in the micro and nano meter range. Comparable to microelectronics the miniaturization and integration is onegoing. So the scaling of dimensions has a big influence on functional principles as well on the design of the elements and components. Moreover, the diversity of technologies and the intergration of heterogeneous functionalities are increasing, too. Design and test require a stronger combination of component and system design methodes. There is not only a mechanical design necessary but also the integration of stationary electrical and magnetic fields, electromagnetic waves in micro wave and terahertz range as well as optical radiation, the electronic function and oftenaspects of signal and system theory. Due to heterogeneous composition it is often impossible to do this only based on one simulation tool. Also in the field of measuring technique a lot of different devices or meters have to be applied.
The core competence "Design and Test of Components and Systems" combines all simulation, layout and design methods for the development of components and systems with the test methods for analyzing and characterizing geometrical, topographical and functional parameters. Design and test of high precision MEMS/NEMS as well as the development of fast, broad band near field measuring technique are unique features of the core competence. The interaction with the technology driven core competence like "Silicon Based Technologies for Micro and Nano Systems" and "Polymer Based Technologies for Micro and Nano Systems" and "Polymer Based Technologies for Micro and Nano Systems" ogether with their technology platforms has a positive influence on the core competence "Design and Test of Components and Systems". The basis for the excellent reputation are the high quality technical equipment (design software, models, measuring technique for functional characterization of MEMS on the wafer, chips and system level, application adapted functional test, RF test, reliability and analysis of tolerances, software algorithm) as well as the highly educated and qualified stuff.
The departments Multi Device Integration and Abteilung Advanced System Engineering mainly contribute to this core competence of Fraunhofer ENAS.




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