MEMS active probe

Test

Wafer and chip test

  • Electrical parameters
  • RF S parameters
  • Nonlinearity
  • Dielectric material parameters
  • Transmission and reflection
  • Surface parameters
  • Vibrational analysis
  • Combination of numerical simulation and characterization methods for parameter identification
  • Electromagnetic compatibility
  • Specific probe card development

 

Test programs for component and system tests

  • Controllable optical filters
  • Acceleration sensors
  • Gyroscopes
  • RF MEMS switches
  • Wireless sensor nodes

 

Reliability

  • Mechanical strain: pulling, pressure, shearing, bending, scratch, vibration, shock
  • Structural reliability of composites (fatigue master curve)
  • Compact tension (CT) fracture mechanical tests: single and multi-mode, critical and sub-critical, bulk and interfaces
  • Nanofatigue, membrane tests
  • Thermoelectromechanical endurance: HT, (H)TC, APC
    • Thermal cycle test: -80 °C  ... 500 °C,
    • Power cycle tests: up to 500 A, 80 V (air, oil)
  • Accelerated lifetime tests with mixed loads:
    • Temperature cycle: -60 °C ... 180 °C
    • Humidity range: 10 % ... 90 %
    • Mechanical vibration: 0.1 Hz … 3 kHz
    • Electrical loads: bias voltage, electrical power
  • Environmental testing: humidity, degradation, corrosion
    • Climate storage and shock testing: -60 °C ... 180 °C, humidity 10 %.... 90 %, salt dust      
  • Field-like long-term climatic and stress tests: 2 …10 years in the underground reliability lab (old silver mine)
  • RF and microwave performance: functionality, electromechanical compatibility
  • Near field measurement for EMC tests and debugging